Silicon chip Etching equipments
- Name:Silicon chip Etching equipments
- Power: 45kw/380V/50Hz
- Work width: 650mm
- Work thickness: 0.1-3mm
- Work height: 950±20mm
- Tolerance: ±2mil
- Transfer speed: 0 - 6.5M/min
- Outsize: 16500*1650*2000mm
- Process:
- Enter → Developing → Overflow washing → Water washing → blot dry →
- Checking→ Etching → Acid washing → Overflow washing → Water washing →
- blot dry →Checking → Stripping → Slight brush washing → Overflow
- washing →Water washing→ blot dry → Exit
- Function:
- DES(Developing-Etching-Stripping) systems for silicon chip, PCB, FPC to Automatic developing, etching and stripping works.
you may need these machines for etching:

Baking Oven

Single exposure machine

Golden Plating equipments